Deadline: LEADFREE SOLDERING IN INTERCONNECTION AND PACKAGING MICROELECTRONICS. Versailles

Welcome

12.01.2004
Deadline: LEADFREE SOLDERING IN INTERCONNECTION AND PACKAGING MICROELECTRONICS. Versailles
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Within the framework of the 14th Forum of the Interconnection and Microelectronic Packaging, IMAPS organises conferences on:



Three topics are considered:
  • Specific technologies of the components.
  • Brazing materials.
  • Impact on the processes and the supports.
    Your company is interested in:
  • communicating in any of above topics.
  • sharing experience.
  • communicating in any of above topics through an oral presentation or a poster.
    Please submit your proposals by January 15 latest, by fax or e-mail to :
    Florence Vireton
    Fax : 01 39 67 17 73.
    Email : imapsfrance@imapsfrance.org
http://www.imapsfrance.org/callforpap2.htm