Presentation - Optimization of Lead-free Solder Paste for Robust Process and Reliable Solder Joint
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18.04.2006
Presentation - Optimization of Lead-free Solder Paste for Robust Process and Reliable Solder Joint
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Avantec EFSOT-Testboard Paste.pdf
(1.56 MB)
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AUTHOR: Anne Marie Laügt, Avantec, France
DATE: Electronic Goes Green September 06, 2004
Test methodology
First solder paste generation
Parameters to improve
Second generation
Solder joint reliability
©2003 Technische Universität, Berlin
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