Solder Material and Technologies

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07.09.2005
Solder Material and Technologies
EFSOT_solder_material_and_technologies_2005_06_03
For a lot of applications, especially at elevated operating temperatures (e.g. automotive electronics) the limitations of solder joints are crucial. They are not yet clearly defined for lead-free solder joints, and new developments in this project cause further need for re-assessment. The limitations will be tested for different materials and designs. It will enable a matrix to recommend or disqualify materi-als and design rules for defined extreme applications.

See WP1T5 - Operating  Limitations of Lead-Free Solder Joints WP1T5 - Operating Limitations of Lead-Free Solder Joints
 

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