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EFSOT - eBook : The Life Cycle of Leadfree S...
Aufreisser
Glossary
(empty)
2nd level interconnect
AEC
Allocation
bulk solder
CEM
CR
crack
creeping rate
creeping resistance
CSP
Deposit Types
EEE
EFSOT
EI99
EIA
EICTA
Electrical and electronic equipment
EMS
Energy
HAL
HVQFN
IPC
JEDEC
JEITA
JGPSSI
KW
LCA
lead-free
lead-free category, Pb-free category
NEDA
NEMI
OEM
OEM
OSP
Pb-free
Pb-free Second Level Interconnect
PCB
PGM
PM
producer
PWB
Recovery rate
Recycling rate
Relaxation time
Ressource Depletion
RoHS
RoHS Compliance
rpm
RT
Shrinking
solder joints
surface crack
Surplus Energy
Sustainable Development
Temperature Shock Test
totally lead-free
Toxicity data
WEEE
wettability
Whisker
Legal Rules - European Directives
RoHS - EU - Directive on the Restricti...
WEEE
Dangerous substances
Literature, Links and Events
EFSOT-Project in other publications
Links to Other Projects
R&D in Enterprises
R&D-Institutes and Organisations
IPC Soldertec 3rd International Confer...
EFSOT Booth on EGG2004+
Aufreisser
Events, Conferences and other related ...
Solder Material Development
The EFSOT Test-Board Design
The EFSOT Verification Board Design
Lead Free Pastes
Procedures & Test Procedures
The Production of Lead, Zinc, Gold and...
Database of Solder Materials, Substanc...
Solder Material and Technologies
Business Driven Information and Knowle...
Fine Pitch Technologies
Soldering Technologies
Reliability of Lead-free Solder Connec...
Life Cycle Assessment - Soldering in Euro...
Life-Cycle Phases
Life Cycle Assessment
Methodology
End of Life of Lead-free Electronic Devic...
Service (empty)
Repair & Reuse
Material Recycling
Incineration (Thermal Recycling) (empt...
Landfill (empty)
Collection Rates from Recycling (empty...
Resource consumption and recycling
Biological Impact of Materials
Toxicology of Metals
Waste Paths of Metals
Biological impact of materials