Bill of materials (BOM)

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12.04.2005
Bill of materials (BOM)
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PartMaterial Weight per part (mg) Quantity
SubstrateFR4-4 layer-Cu-OSP
37878,21
EFSOT-BGA 416BGA25648001
EFSOT-HSOP20HSOP202051,143
EFSOT-SOT 248 - D-PackSOT428-D-Pack3522
EFSOT-HVQFN48 HVQFN48128,055
EFSOT-IP4041CX25
IP4041CX25n.A 2
EFSOT-LFBGA180 LFBGA1805012
EFSOT-LQFP128 LQFP128632,55
EFSOT-RCA-0,5-CONVEX RCA-0,5-CONVEXn.A 4
EFSOT-RCA-0,8-CONVEXRCA-0,8-CONVEXn.A 4
EFSOT-SOD323
SOD323 56
EFSOT-TFBGA228
TFBGA228 3303
EFSOT-RE0201
RE0201 0,250
EFSOT-CA0201
CA02010,2560
EFSOT-RE0402 RE04020,840
EFSOT-CA0402CA0402 1,440
EFSOT-RE0603RE0603 250
EFSOT-CA0603 CA0603650
EFSOT-RE0805 RE08054,825
EFSOT-CA0805CA0805 1525
EFSOT-RE1206 RE1206920
EFSOT-CA1206 CA12063520
Connector Pin 1 Connector Pin 1n.A1
Connector Pin 2 Connector Pin 2n.A1
SolderSnZnBin.A1


PartMaterialWeight (mg)
FR4Brominated epoxy resin16830
Glass23220
MetalCu6990
SoldermaskAcrylate/Novolak640
Total47680