EFSOT Verification Board Thomson - SnAg4Cu0.5 - Substrate FR4-4 layers-Cu-OSP
Welcome
Jump to content
Jump to footer
Hauptnavigation
::: LifeCycle :::
Solder Material Development
Soldering Technologies and Reliability
Biological Impact of Metals
End of Life
LCA: Soldering in Europe
Legal Rules
Literature & Links
Glossary
::: Network :::
Project Intern
MyEFSOT
Experts
::: Service :::
> advanced search
What is new?
Navigator
Help
Login
[
EFSOT-InfoBase
>
Start
>
eBook: Topics Overview
>
Material & Technologies
>
Info Management
>
Knowledge
>
Verification Board
>
THRe4371EFSOVerBo0003
]
13.04.2005
EFSOT Verification Board Thomson - SnAg4Cu0.5 - Substrate FR4-4 layers-Cu-OSP
50 pieces: THRe4371EFSOVerBo0003xxxxG = 101-150
Bill of materials (BOM)
Life Cycle Information
Material data - Bill of substrates
Galery
Glossary Terms
EFSOT
©2003 Technische Universität, Berlin
Top
Version for print