Power Hybrid for Electronic Motor Control

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06.09.2004
Power Hybrid for Electronic Motor Control
3 - Industrial

Product Description
  • Chip & Wire technology on AL2O3 Substrate
  • NPT semiconductor technology
  • Lead free vacuum soldering of semiconductors & connector pins
  • Hybrid assembly into custom specific module housing
  • Assembly sealed with soft high voltage silicon gel (24 kV/mm)
  • UL certificate of compliance for complete power module

AB Mikroelektronik GmbH - Josef-Brandstätter-Str. 2 - 5020 Salzburg - Austria - www.ab-mikro.at

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