Deadline: LEADFREE SOLDERING IN INTERCONNECTION AND PACKAGING MICROELECTRONICS. Versailles

Within the framework of the 14th Forum of the Interconnection and Microelectronic Packaging, IMAPS organises conferences on:



Three topics are considered:

• Specific technologies of the components.
• Brazing materials.
• Impact on the processes and the supports.
  Your company is interested in:

• communicating in any of above topics.
• sharing experience.
• communicating in any of above topics through an oral presentation or a poster.
  Please submit your proposals by January 15 latest, by fax or e-mail to :
  Florence Vireton
  Fax : 01 39 67 17 73.
  Email : imapsfrance@imapsfrance.org

http://www.imapsfrance.org/callforpap2.htm