The EFSOT Verification Board Design

Information about the EFSOT project
EU-CONTRACT N° : G1RD-CT-2002-00838
PROJECT N° : IMS-2001-00028
ACRONYM : EFSOT
EU-Coordinator TU Berlin, Otmar Deubzer

The EFSOT Verification Board

This is the design of the EFSOT reviewed, so called "verification board", the second test board of the EFSOT project, which is used to develop a lead-free SnAgCu fine pitch solder paste.

If you wish to use this board, you will find all necessary information in this folder on the EFSOT Europe InfoBase (http://www.efsot-europe.info --> Soldering Material Development).
General Info: Read First (pdf)

The board offers many features to test properties of lead-free solder pastes and to evaluate different footprints and solder paste properties:

• 0201, 0402, 0603, specific components
• Insulation, printing, solder wetting and solder balling test
• place for the reused LQFP128, formerly assembled on the first testboard series, then desoldered and now soldered again.

Contacts
If you have any questions or comments, you are welcome to contact the following persons:

• General contact and information: Otmar Deubzer
• Solder pastes: Bernard Tournier, Avantec
• Components, reflow profiles, design issues:
  Paul Evers, Philips CFT , Further mention for details on the organization the CFT Internet http://www.cft.philips.com ; Jacob Klerk
  Didier Caban, TTE (TCL Thomson Electronics EUROPE SAS)
  Especially in the context with ceramic substrates, thickfilm hybrids:
  Peter Wilczek and Gregor Spilka, TT Electronics, AB Mikroelektronik, Salzburg

We make sure that we will use your contact dates only for issues in that project, not distributing or selling them.