This is the design of the EFSOT test-board, which the partners mentioned above used to develop a lead-free SnAgCu fine pitch solder paste.
The board offers many features to test properties of lead-free solder pastes and to evaluate different footprints and solder paste properties:
The board offers many features to test properties of lead-free solder pastes and to evaluate different footprints and solder paste properties:
- 0201, 0402, 0603, specific components
- Insulation, printing, solder wetting and solder balling test
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AUTHOR: Luis Irasarri , Date: 2004-11-30, Task: 4T6, Version: 2 -
AUTHOR: Didier Caban, Thomson, France
DATE: EFSOT Meeting Eindhoven, September 30, 2003 -
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Version for print