For a lot of applications, especially at elevated operating temperatures (e.g. automotive electronics) the limitations of solder joints are crucial. They are not yet clearly defined for lead-free solder joints, and new developments in this project cause further need for re-assessment. The limitations will be tested for different materials and designs. It will enable a matrix to recommend or disqualify materi-als and design rules for defined extreme applications.
Matte tin tends to become one of the preferred platings of the future. However, tin surfaces showed increased whiskering and insufficient knowledge is available on the root cause and main influence factors of whisker formation. As long whiskers can even cause short cuts, this is a road block for introduction of lead-free platings. Understanding the root cause on tin and other surfaces allows es-tablishment of a standard test for reliable quantification and control of whiskering.
Matte tin tends to become one of the preferred platings of the future. However, tin surfaces showed increased whiskering and insufficient knowledge is available on the root cause and main influence factors of whisker formation. As long whiskers can even cause short cuts, this is a road block for introduction of lead-free platings. Understanding the root cause on tin and other surfaces allows es-tablishment of a standard test for reliable quantification and control of whiskering.
Top
Version for print