| Begin: | 07.06.2005 |
| End: | 09.06.2005 |
| Location: | Hotel Fira Palace, Barcelona, Spain |
IPC Soldertec 3rd International Conference on Lead Free Electronics
Together with most interesting and value presentations of lead-free researchers and practioners will get three presentations of project partners in Barcelona:
- Session 1, 11:00: Overview of Lead Free SnAgCu Alloys Evaluation and Reliability Test Program
Bernard Tournier, Avantec
- Session 1, 15:00: Marking of Electronic Components and Board Assemblies as RoHS Compatible ? Information in the Supply Chain and Logistics
Irina Stobbe Ph.D., Berlin Center of Advanced Packaging BeCAP@ Technical University Berlin/Fraunhofer IZM
- Session 3, 8:30: Microstructure of Sn-Ag-Co Solder Reacted with Cu Substrate
Hiroshi Nishikawa Ph.D., Osaka University
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