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Towards implementation of the RoHS directive
The industry is racing to meet the EU RoHS Directive (Restriction of Hazardous Substances in Electrical and Electronic Equipment) where all affected electrical equipment sold in Europe after July 1, 2006, will be required to be lead free. All suppliers, assemblers and retailers need to be aware of the current situation.
To help the industry prepare for this momentous change, IPC Association Connecting Electronics Industries and Soldertec Global - a division of Tin Technology, are sponsoring the 3rd International Conference on Lead Free Electronics, to take place June 7-9, 2005, in Barcelona, Spain. IPC and Soldertec Global will bring the industry's top experts together for a major European conference on this subject.
Critical lead free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs perhaps 15% higher and will be impacted in areas beyond manufacturing such as field support, sales, marketing and training. Companies must learn to meet the new lead free criteria in revised electronics assembly standards. Prior to and at the conclusion of the technical conference, in-depth educational courses will be offered to enhance your knowledge on a variety of lead free issues. Don't miss this opportunity - Register Now!
Or follow the link for more information:
http://www.ipc.org/calendar/LFConf_605/LFConf605.htm
Together with most interesting and value presentations of lead-free researchers and practioners will get three presentations of project partners in Barcelona:
To help the industry prepare for this momentous change, IPC Association Connecting Electronics Industries and Soldertec Global - a division of Tin Technology, are sponsoring the 3rd International Conference on Lead Free Electronics, to take place June 7-9, 2005, in Barcelona, Spain. IPC and Soldertec Global will bring the industry's top experts together for a major European conference on this subject.
Critical lead free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs perhaps 15% higher and will be impacted in areas beyond manufacturing such as field support, sales, marketing and training. Companies must learn to meet the new lead free criteria in revised electronics assembly standards. Prior to and at the conclusion of the technical conference, in-depth educational courses will be offered to enhance your knowledge on a variety of lead free issues. Don't miss this opportunity - Register Now!
Or follow the link for more information:
http://www.ipc.org/calendar/LFConf_605/LFConf605.htm
Together with most interesting and value presentations of lead-free researchers and practioners will get three presentations of project partners in Barcelona:
- Session 1, 11:00: Overview of Lead Free SnAgCu Alloys Evaluation and Reliability Test Program
Bernard Tournier, (inbehalf of IPC working group)
- Session 1, 15:00: Marking of Electronic Components and Board Assemblies as RoHS Compatible ? Information in the Supply Chain and Logistics
Irina Stobbe Ph.D., Berlin Center of Advanced Packaging BeCAP@ Technical University Berlin/Fraunhofer IZM
- Session 3, 8:30: Microstructure of Sn-Ag-Co Solder Reacted with Cu Substrate
Hiroshi Nishikawa Ph.D., Osaka University
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