Glossary

Welcome

07.09.2005
Glossary
Under permanent rework - please support providing your definitions and remarks
  • Call Navigator for (e)
    (e) = (empty) = Folder is empty! Content is not available.
  • Call Navigator for 2nd level interconnect
    The interconnect between a device/component and the printed circuit board.
  • Call Navigator for AEC
    AEC
    Automotive Electronics Council
  • Call Navigator for Allocation
    regarding the resource deposits
    to define by Mark
  • Call Navigator for bulk solder
    massive solder in contrast to solder powder or paste
  • Call Navigator for CEM
    CEM
    contract electronic manufacturer
  • Call Navigator for CR
    CR
    creeping resistance
  • Call Navigator for crack
    to define by Peter and Jacob, please add some picture !
  • Call Navigator for creeping rate
    the converse of "creeping resistance"
  • Call Navigator for creeping resistance
    see CR
  • Call Navigator for CSP
    chip size package or chip scale package
  • Call Navigator for Deposit Types
    to define by Mark
  • Call Navigator for EEE
    EEE
    electrical and electronic equipment
  • Call Navigator for EFSOT
    Next Generation Environmentally-Friendly Soldering Technology - international integrated project on lead-free soldering, IMS project, with parts in Europe, Japan and Korea
  • Call Navigator for EI99
    to define by Mark

    describe the new coefficient too
  • Call Navigator for EIA
    EIA
    Electronic Industry Alliance
  • Call Navigator for EICTA
    European Industry Association for Information Systems, Communication Technoogies and Consumer Electronics
  • Call Navigator for EEE2
    EEE - Electrical and electronic equipment
  • Call Navigator for EMS
    EMS
    electronic manufacturing service
  • Call Navigator for Energy
    to define by Mark
  • Call Navigator for HAL
    HAL
    hot air leveling, HASL - hot air solder leveling
  • Call Navigator for HVQFN
    Heatsink Very-thin Quad Flat-pack No-leads
  • Call Navigator for IPC
    IPC
    IPC ? Association Connecting Electronics Industries
  • Call Navigator for JEDEC
    Joint Electronic Device Engineering Council
  • Call Navigator for JEITA
  • Call Navigator for JGPSSI
    Japan Green Procurement Survey Standardization Initiative
  • Call Navigator for KW
    KW
    "Kriechwiderstand", German term for creeping resistance, see "CR"
  • Call Navigator for LCA
    LCA
    Life cycle assessment
  • Call Navigator for lead-free
    Pb-free
  • Call Navigator for lead-free category
  • Call Navigator for NEDA
    National Electronic Distribution Association (US)
  • Call Navigator for NEMI
    National Electronics Manufacturing Initiative
  • Call Navigator for OEM
    original electronic manufacturer
  • Call Navigator for OEM
    OEM
    original equipment manufacturer
  • Call Navigator for OSP
    OSP
    Organic Solderability Preservatives
  • Call Navigator for Pb-free
  • Call Navigator for Second Level
  • Call Navigator for PCB
    PCB
    printed circuit board, alternative to printed wiring board (PWB)
  • Call Navigator for PGM
    PGM
    Platinum Group Metals
  • Call Navigator for PM
    PM
    Person month, gender neutral and explicitly including the other, "better" 50 %;
    politically more correct equivalent to man month
  • Call Navigator for producer
    Definition from the WEEE directive
  • Call Navigator for PWB
    PWB
    Printed wiring board, alternative to printed circuit board
  • Call Navigator for Recovery rate
    Quotient of mass of material which remains available in the economic circle after recycling and the total mass input into this recycling process
  • Call Navigator for Recycling rate
    Quotient of number of recycled PWBs which were produced in a certain year and total number of produced PWBs in that year
  • Call Navigator for Relaxation time
  • Call Navigator for Ressource Depletion
    to define by Mark
  • Call Navigator for RoHS
    DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment
  • Call Navigator for RoHS Compliance
    RoHS compliance includes materials compliance, but not the process and reliability requirements for lead-free soldering.
    All components, board and solder material should be fulfil the requirements of §5 RoHS, including be lead-free (until the maximum concentration value (MCV))
  • Call Navigator for rpm
    rpm
    revolutions per minute
  • Call Navigator for RT
    RT
    room temperature
  • Call Navigator for Shrinking
  • Call Navigator for solder joints
    interconnections made with a filler metal with a lower
    melting point than base metal
  • Call Navigator for surface crack
    due to shrinking
    to define by Peter and Jacob, please add some picture !
  • Call Navigator for Surplus Energy
    to define by Mark
  • Call Navigator for sustainable Dev
    to define by Otmar
  • Call Navigator for Temperature Shock Test
  • Call Navigator for totally lead-free
    totally Pb-free
  • Call Navigator for Toxicity data
    to define by Mark
  • Call Navigator for WEEE
    EU - Directive on Waste Electrical and Electronic Equipment 2002/96/EG
  • Call Navigator for wettability
    Contact angle of adhesive dropped onto a material indicates the material's wettability. The lower the contact angle, the more wettable is the surface.
  • Call Navigator for Whisker
    single crystals, protruding from electroplated layers, originating from diffusion under the influence of compressive stress