Eco-Design Guidelines for Verification Board

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14.06.2006
Eco-Design Guidelines for Verification Board
4T6
4T6. DESIGN GUIDE LINES FOR EFSOT VERIFICATION BOARD
IDEAL HIGH APPROACH EFSOT-1 MEDIUM APPROACH EFSOT-2 LOW APPROACH
Laminate FR-4 FR-4 FR-4
Polymer BIO PLASTIC (NEC) Epoxy Epoxy
Flame retardant additive Non BFRs, non phosphorus (NEC additive) Try silicon compounds like additives "Assay Chemicals" ones Non halogenated
Structural reinforcement Biodegradable fibers Woven glass  Woven glass
Solder SAC (no Bi) Pb free (no Bi, Sb,In,Al) Pb free (no Bi)
Aluminium  heat sunk components (if applied) Adhesive joint for easy removal in shredder Adhesive joint for easy removal in shredder Joint for easy removal in shredder
Fe frame (if applied) Magnetic material. Easy to liberate by coarse shredding Magnetic material. Easy to liberate by coarse shredding Magnetic material. Easy to liberate by coarse shredding
Cables cover (if applied) Use reticulated polyolefine if technically possible. If use PVC avoid:  hazardous phtalates and Pb, Cd and organometallic Sn additives. Use PVC avoiding hazardous phtalates and Pb, Cd and organometallic Sn additives Use PVC avoiding hazardous phtalates and Pb, Cd and organometallic Sn additives
En-capsulated components or sub.assemblies Friable silicone Epoxy Epoxy
Package Maximise density of components Maximise density of components Maximise density of components
Connectors Bio Plastic non BFRs, non phosphorous additives non BFRs, non phosphorous additives,non PVC. Try Assay additives PVC avoiding hazardous phtalates, Pb,Cd or organometallic Sn additives.
Avoid these elements (if possible) Mg,Co,Mn,Cr,BeO,Se,Te,As,F Co,Cr,BeO,As Cr,BeO,As
Ni content Keep < 2% over total weight of PCB  Keep < 5% over total weight of PCB  Keep < 5% over total weight of PCB 
::: Contents :::
Aditivos silicon FR.jpg (Alt+A)  Aditivos silicon FR.jpg (452.19 KB)
Bio-Plastic-NEC.htm (Alt+W)  Bio-Plastic-NEC.htm (7.81 KB)
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