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This folder contains all relevant data for project external people which they need to reproduce the EFSOT Test Board for lead-free solder paste development . Download the materials, providing only your email, name and affiliation.
Information about the EFSOT project
EU-CONTRACT N° : G1RD-CT-2002-00838
PROJECT N° : IMS-2001-00028
ACRONYM : EFSOT
EU-Coordinator TU Berlin, Otmar Deubzer
The EFSOT Test-Board
This is the design of the EFSOT test-board, which the partners mentioned above used to develop a lead-free SnAgCu fine pitch solder paste. If you wish to use this board, you will find all necessary information in this folder on the EFSOT Europe InfoBase (http://www.efsot-europe.info --> Soldering materials).
The board offers many features to test properties of lead-free solder pastes and to evaluate different footprints and solder paste properties:
Contacts
If you have any questions or comments, you are welcome to contact the following persons:
EU-CONTRACT N° : G1RD-CT-2002-00838
PROJECT N° : IMS-2001-00028
ACRONYM : EFSOT
EU-Coordinator TU Berlin, Otmar Deubzer
The EFSOT Test-Board
This is the design of the EFSOT test-board, which the partners mentioned above used to develop a lead-free SnAgCu fine pitch solder paste. If you wish to use this board, you will find all necessary information in this folder on the EFSOT Europe InfoBase (http://www.efsot-europe.info --> Soldering materials).
The board offers many features to test properties of lead-free solder pastes and to evaluate different footprints and solder paste properties:
- 0201, 0402, 0603, specific components
- Insulation, printing, solder wetting and solder balling test
Contacts
If you have any questions or comments, you are welcome to contact the following persons:
- General contact and information: Otmar Deubzer
- Solder pastes: Bernard Tournier, Avantec
- Components, reflow profiles, design issues:
Paul Evers, Philips CFT , Further mention for details on the organization the CFT Internet http://www.cft.philips.com ; Jacob Klerk
Didier Caban, TTE (TCL Thomson Electronics EUROPE SAS)
Especially in the context with ceramic substrates, thickfilm hybrids:
Peter Wilczek and Gregor Spilka, TT Electronics, AB Mikroelektronik, Salzburg
We make sure that we will use your contact dates only for issues in that project, not distributing or selling them.
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AUTHOR: Luis Irasarri , Date: 2004-11-30, Task: 4T6, Version: 2
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